Inventory:5380

Technical Details

  • Features Board Guide, Closed Frame
  • Mounting Type Surface Mount
  • Type SOIC
  • Number of Positions or Pins (Grid) 8 (2 x 4)
  • Termination Solder
  • Material Flammability Rating UL94 V-0
  • Housing Material Liquid Crystal Polymer (LCP)
  • Pitch - Mating 0.050" (1.27mm)
  • Contact Finish - Mating Gold
  • Contact Finish Thickness - Mating 15.0µin (0.38µm)
  • Contact Material - Mating Phosphor Bronze
  • Pitch - Post 0.050" (1.27mm)
  • Contact Finish - Post Gold
  • Contact Finish Thickness - Post Flash
  • Contact Material - Post Phosphor Bronze
  • Contact Resistance 30mOhm

Related Products


SPI 8 PIN_IC 208mil

Inventory: 1850

SPI 16 PIN_IC 300mil

Inventory: 630

Top