Fudan Microelectronics
Founded in 1998 and headquartered in Shanghai, Shanghai Fudan Microelectronics Group Co., Ltd. (Stock Codes: 01385.HK, 688385.SH) is a leading IC design company in China. Specializing in security & identification chips, smart meter ICs, FPGAs, and non-volatile memory, the company serves sectors including finance, social security, automotive electronics, and 5G communications, with over 10 billion chips shipped globally. Key clients include Huawei, China Mobile, and BYD. In 2024, the company achieved revenue of ¥3.59 billion, with R&D investment accounting for 31.8% of sales. Its 1xnm FPGA chips entered pilot production, and automotive MCUs exceeded 10 million units in shipments. Product Features & Advantages Security & Identification Technology Leadership Financial IC Cards：Supporting national cryptographic algorithms (SM2/SM3/SM4) and PCI 3.0 certification, with 5 billion+ units shipped globally for UnionPay and Visa-compliant payment systems. RFID Solutions：Industry-first dual-band (HF/UHF) temperature-monitoring RFID chips with physical unclonable function (PUF), deployed in cold chain logistics and unattended retail, 累计出货超 100 亿片. Automotive Security Chips：AEC-Q100-certified chips with hardware security modules (HSM) for vehicle authentication and data encryption, achieving 2 million+ front-loading automotive solutions in 2024. Smart Meter & MCU Localization Breakthroughs Smart Meter MCUs：60%+ market share in single-phase meter MCUs, supporting China’s new smart grid standards with <1mW power consumption, 累计销售 4 亿颗. Industrial MCUs：ARM Cortex-M3-based 32-bit MCUs with ISO 26262 ASIL-B certification, serving industrial robotics and smart grids, with 50 million+ units shipped in 2024. FPGA & Advanced Process Innovations Billion-Gate FPGAs：Domestic first 28nm FPGA supporting 5G base stations, integrating CPU+FPGA+AI architecture for edge computing and signal processing, supplied to Huawei and ZTE in pilot quantities. Heterogeneous Reconfigurable Chips：FPAI, China’s first AI-oriented reconfigurable chip, supports TensorFlow Lite models with <500mW inference power, used in security surveillance and smart devices. Non-Volatile Memory Ecosystem EEPROM：Leading domestic market share with 100 million+ monthly shipments, operating across -40℃ to 125℃ for automotive and IoT applications. NOR Flash：AEC-Q100-certified high-reliability products with 128Mb capacity, adopted in automotive infotainment systems, contributing 15% of automotive revenue in 2024. Industry Collaboration & Standardization Ecosystem Partnerships：Co-founded the National IC Innovation Center with Fudan University, participating in standards like Automotive IC Stress Test Specification to accelerate global certification of domestic chips. Open-Source Innovation：Developed the "WUJI" 32-bit RISC-V microprocessor using 2D semiconductors, integrating 5,900 transistors to push Moore’s Law boundaries, 引领下一代芯片技术.
