Nexperia
Founded in 2006 and headquartered in Jiaxing, Zhejiang Province, Wingtech Technology Co., Ltd. is a global leader in semiconductor and smart terminal solutions. Centered on the "Semiconductor+" strategy, the company operates through its wholly-owned subsidiary Nexperia, establishing a full industrial chain covering chip design, wafer fabrication, and packaging/testing. Its products focus on power semiconductors, logic devices, and third-generation semiconductors (SiC, GaN). Nexperia, formerly Philips Semiconductors' standard product division, boasts over 60 years of semiconductor R&D and manufacturing experience. As one of the world's largest automotive-grade discrete device suppliers, 90% of its products meet AEC-Q100 standards, with all wafer fabs automotive-certified. In 2025, Wingtech divested its consumer electronics ODM business to focus on semiconductors and automotive electronics, partnering with Samsung, KOSTAL, and other global giants. Its third-generation semiconductor revenue grew 3.6 times year-on-year, ranking among the top five global power semiconductor suppliers. Product Features & Advantages Automotive-Grade Power Semiconductor Leadership Full-Series MOSFET & IGBT：Covering -100V to 1500V voltage ranges, SGT MOSFETs match international benchmarks, with automotive electronics sales exceeding 63% in 2024. Third-Generation Semiconductor Breakthroughs： SiC MOSFET：1200V automotive-grade products, AEC-Q100 certified, reduce conduction loss by 30% and support 800V high-voltage platforms, applied in BYD and NIO main drive inverters. GaN FET：Industry’s only supplier of both cascode (D-mode) and enhancement-mode (E-mode) devices, CCPAK packaging achieves 2000V/mm electric field strength, supporting 500kHz high-frequency switching with 20% higher power density. Automotive-Grade Logic IC：MicroPak XSON5 leadless packaging saves 75% PCB space and triples moisture resistance, suitable for smart cockpit multi-screen interaction. Packaging Technology & Process Innovation CCPAK Copper Clip Packaging：Reduces thermal resistance by 50%, ideal for high-power applications like EV OBC and photovoltaic inverters. LFPAK Packaging：Lower on-resistance by 30% compared to traditional packages, widely used in motor control and power management. Full-Scenario Product Portfolio Automotive Electronics：Automotive-grade IGBT modules support ISO 26262 ASIL D functional safety, with over 1000 part numbers per vehicle, covering main drives, BMS, and ADAS. Industrial & Energy：1200V SiC diodes enhance photovoltaic inverter efficiency by 5%; GaN fast-charging solutions support 100W+ ultra-fast charging. Consumer Electronics：65W GaN fast-charging SiP modules, 40% smaller in size, mass-produced for smartphones and laptops. Ecosystem Collaboration & Domestic Substitution Supply Chain Integration：Partnerships with Naura and Jingce Electronics enable localized etching and thin-film deposition equipment, ensuring self-sufficiency in critical processes. Market Impact：Global power semiconductor market share exceeded 5% in 2025, with over 100 billion automotive-grade products shipped and 70% penetration in domestic new energy vehicle customers.
