CR Micro
CR Microelectronics Co., Ltd. (CR Micro), founded in 2003 and headquartered in Wuxi, Jiangsu Province, is a core semiconductor enterprise under China Resources Group. As a leading IDM (Integrated Device Manufacturer) in China, CR Micro has established a full industrial chain covering chip design, wafer fabrication, and packaging/testing, with a focus on power semiconductors, smart sensors, and intelligent control. The company operates 12 R&D centers in Wuxi, Shanghai, Shenzhen, etc., and owns 5 6-8-inch and 2 12-inch wafer fabs (Chongqing and Shenzhen), with the Chongqing 12-inch fab achieving a monthly capacity of 30,000 wafers in 2025 and the Shenzhen fab ramping up production. In 2024, CR Micro achieved revenue of ¥7.472 billion, with automotive-grade products accounting for 40% of total sales. The third-generation semiconductor (SiC, GaN) revenue grew 3.6 times year-on-year, ranking among the top three domestic players in the global power semiconductor market. The company continues to deepen collaborations with leading enterprises such as BYD, Geely, and Sungrow, with automotive-grade IGBT modules and SiC MOSFETs mass-produced for new energy vehicle main drives and photovoltaic inverters. Product Features & Advantages Power Semiconductor Leadership Full-Series MOSFET & IGBT：Covering -100V to 1500V voltage ranges, SGT MOSFET products match international benchmarks, with industrial and automotive electronics sales exceeding 85% in 2024. Third-Generation Semiconductor Breakthroughs： SiC MOSFET：The CRXQF75M120G2Q model, AEC-Q100 certified, supports 800V high-voltage platforms with 30% lower conduction loss, applied in BYD and NIO main drive inverters. GaN Power Devices：Launched 100V enhancement-mode GaN products supporting 500kHz high-frequency switching, with 20% higher power density for fast charging and data center power supplies. Automotive-Grade Solutions：IGBT modules certified to ISO 26262 ASIL D functional safety standards, supporting smart cockpit multi-screen interaction and supplied to JAC Refine RF8. Smart Sensors & Specialty Processes MEMS Technology：8-inch MEMS microphone process platform mass-produced with international-level parameters, ranked second in China's MEMS top 10 in 2024. BCD Technology：0.11μm BCD technology leads globally, integrating high-voltage and high-precision analog circuits for industrial control chips. IDM Model & Ecosystem Collaboration Vertical Integration Advantages：In-house wafer fabs ensure stable capacity, with the Chongqing advanced packaging base achieving automotive-grade module packaging in 2025, reducing costs by 15%. Domestic Substitution Acceleration：Collaborations with Naura and Jingce Electronics enable localized etching and thin-film deposition equipment, ensuring self-sufficiency in critical processes.
