UNISOC
UNISOC (Shanghai) Technology Co., Ltd., established in 2016 through the integration of Spreadtrum Communications (founded in 2001) and RDA Microelectronics (founded in 2004), is a core enterprise under Tsinghua Unigroup. As a global leader in Fabless semiconductor design, UNISOC focuses on mobile communications, IoT, automotive electronics, and industrial electronics, offering products including smartphone chips, 5G basebands, satellite communication SoCs, and automotive-grade chips. Headquartered in Shanghai with 12 R&D centers worldwide, UNISOC serves over 500 clients across 133 countries, including vivo, Xiaomi, Samsung, and Motorola. In 2025, UNISOC completed its joint-stock reform to accelerate IPO preparation, achieving annual revenue of ¥14.5 billion with 82% growth in 5G chip shipments. Its global smartphone chip market share rose to 13%, ranking third. The company continues to advance 6G research, participating in national 6G projects and launching the 5G SoC T8300 to drive the evolution toward "intelligent connectivity for all." Product Features & Advantages Full-Scenario Communication Technology Portfolio 5G Chips： T820: Built on 6nm EUV process, integrates financial-grade security solutions, supports 4K video recording, HDR10+ display, and 8 TOPS AI computing power, widely used in mid-to-high-end smartphones. V517: The first 5G RedCap chip enables lightweight 5G commercialization with 60% power reduction, suitable for smart cities and industrial IoT. V8821: The world's first 3GPP R17 NTN-compliant satellite communication SoC allows direct satellite connectivity for ocean and mountainous areas. 4G Chips: SC9832E, based on 28nm process, integrates quad-core A53 CPU, supports 5-mode Cat.4, and has shipped over 100 million units for entry-level smartphones. Core Technological Breakthroughs 5G NTN Satellite Communication: Completed the world's first L/S-band 5G NTN satellite verification, driving space-ground integrated communication. RedCap Technology: Pioneered R17 RedCap technical verification to lower 5G industry application barriers. AI & Energy Efficiency: Tiger T750 integrates self-developed AI engines for multimodal perception; Ivy V516 reduces communication IP area by 40% with 30% energy efficiency improvement. Ecosystem & Industry Applications HarmonyOS Compatibility: UIS7885 chip supports OpenHarmony, powering domestic tablets with full-stack capabilities from chip to application. Automotive Chips: A7870, AEC-Q100-certified with 200kDMIPS computing power, supports smart cockpit multi-screen interaction in JAC Refine RF8. Industrial & IoT: V510 and V516 chips empower smart power grids and unmanned warehouses, shipping millions of units with CE/FCC certifications.
