HISILIS
Huawei Hisilicon Semiconductor Co., Ltd., established in 2004 and rooted in Huawei's IC Design Center (founded in 1991), is a wholly-owned subsidiary of Huawei Technologies Co., Ltd. As a global leader in Fabless semiconductor design, Hisilicon is headquartered in Shenzhen with 12 R&D centers and offices worldwide. Focusing on enabling intelligent terminals for 万物互联 (IoT), Hisilicon provides high-performance, reliable chips and solutions for consumer electronics, smart homes, automotive electronics, communications, and AI. In 2023, Hisilicon overcame external sanctions by launching the Kirin 9000S and 9010 chips, reinstating Huawei's 5G smartphone capabilities. In 2025, Hisilicon expanded its portfolio with the Kirin X90 desktop processor, certified with Level II security reliability, and deeply integrated with HarmonyOS to drive domestic PC development. Product Features & Advantages Full-Scenario Chip Portfolio Kirin Series: A benchmark for smartphone chips, integrating 5G Modem, self-developed Da Vinci architecture NPU, and advanced processes (e.g., Kirin 990 5G with 7nm+ EUV). Supports NSA/SA 5G dual-mode and leads in AI computing power. The 2025 Kirin X90 extends to desktops, aligning with HarmonyOS for domestic PC needs. Kunpeng Series: High-performance ARM-based server chips with 64-core design, integrated network and storage controllers. Delivers 25% higher computing power and 30% better energy efficiency than industry benchmarks, widely used in data centers and cloud computing. Ascend Series: Full-scenario AI chips (e.g., Ascend 910 for training, Ascend 310 for inference), enabling edge-cloud collaboration for smart security, autonomous driving, etc.. Automotive Chips: The Kirin 9610A, with 200kDMIPS computing power (double Qualcomm 8155), powers smart cockpits in JAC Refine RF8 and other models. Core Technological Breakthroughs 5G Integration: Balong communication chips support multi-band 5G networks, 率先 commercializing NSA/SA dual-mode with superior data performance and low power consumption. AI & Energy Efficiency: Kirin 970 pioneered edge AI with NPU; Ascend series uses Da Vinci architecture for 2x higher computing density. Process & Architecture Innovation: Kirin 9000S employs 5nm process; Kunpeng 920 supports 8-channel DDR4 with 46% higher memory bandwidth. Ecosystem & Partnerships HarmonyOS Connect: Collaborates with Hopewind, Chipsea, etc., to provide end-to-end solutions for smart home devices and health products. Industrial & Automotive: Jointly develops smart home solutions with OPPLE Lighting and China Overseas Land, and automotive ecosystems with JAC and AITO.
