韦尔股份/豪威科技
Shanghai Will Semiconductor Co., Ltd. (Stock Code: 603501.SH), founded in 2007 and headquartered in Shanghai Zhangjiang Hi-Tech Park, is a leading semiconductor design company in China. Listed on the Shanghai Stock Exchange in 2017 and issuing Global Depositary Receipts (GDR) on the SIX Swiss Exchange in 2023, the company specializes in CMOS image sensors (CIS), touch & display driver ICs (TDDI), and analog chips, serving applications including smartphones, automotive electronics, security surveillance, and medical imaging, with over 10 billion chips shipped globally. Its core team consists of senior experts from OmniVision and top domestic universities, with R&D personnel accounting for over 70% of the workforce. The company has applied for over 2,000 intellectual property rights (including 1,200 invention patents). In 2024, Will Semiconductor achieved revenue of ¥25.41-25.81 billion (up 20.9%-22.8% YoY), net profit of ¥3.16-3.36 billion (up 468%-504% YoY), and R&D investment accounting for 15.18% of revenue. Its 50MP+ high-end CIS products penetrated over 60% of the Android flagship smartphone market, while automotive CIS shipments ranked first globally (103 million units in 2023). Key clients include Huawei, Xiaomi, Honor, BYD, and Mercedes-Benz. Product Features & Advantages Global Leadership in CMOS Image Sensors High-End Smartphone CIS： OV50H：50MP sensor with 1.2μm pixels and dual conversion gain (DCG) technology, supporting 4K video and real-time HDR with 30% lower power consumption than peers. Deployed in Xiaomi 14 series, Huawei P70 series, and other flagship models. LOFIC Technology Breakthrough：OV50K40, the world’s first Lateral OverFlow Integration Capacitor (LOFIC)-based sensor, achieves human-eye-level dynamic range in a single exposure, adopted by Honor Magic6 Ultimate Edition for superior low-light imaging. Automotive CIS Market Leader： OX08D10：8MP automotive-grade sensor compatible with NVIDIA Omniverse and Qualcomm Snapdragon Ride platforms, enabling 200m HDR imaging for ADAS. AEC-Q100-certified and integrated with HSM, supporting CAN FD and automotive Ethernet, with over 20 million front-loading automotive solutions shipped in 2024. Domestic Breakthroughs in Touch & Display Solutions TDDI Chips：Full-range products supporting 4K resolution and 120Hz refresh rate, holding 15% global market share in 2024 and used in Huawei, Xiaomi, and other smartphones. OLED Driver ICs：40nm high-voltage OLED driver chips entered risk production with 50% yield, targeting BOE and TCL CSOT, expected to contribute over ¥1 billion revenue in 2025. Analog Chips & Automotive Ecosystem Power Management ICs (PMIC)：Integrated USB-PD 3.1 supporting 140W fast charging, shipped over 500 million units in 2024 for Xiaomi and OPPO. Automotive-Grade Analog Chips：AEC-Q100-certified LDOs and MCUs operating from -40°C to 125°C, used in BYD and NIO’s infotainment systems. Advanced Process & Technology Roadmap 28nm Process Breakthrough：28nm logic platform completed foundational design, scheduled for mass production in 2025 to support AI edge computing and 5G communication chips. Heterogeneous Architecture：Automotive-grade chips integrating CPU+FPGA+AI support TensorFlow Lite deployment with <500mW inference power, applied to automotive radar and smart cockpits. Industry Collaboration & Standardization Ecosystem Partnerships：Co-founded the National IC Innovation Center with Fudan University, participating in standards like Automotive IC Stress Test Specification to accelerate global certification of domestic chips. Open-Source Innovation：Developed a 32-bit RISC-V microprocessor using 2D semiconductors, integrating 5,900 transistors to push Moore’s Law boundaries
