技术参数

• Features Closed Frame
• Mounting Type Through Hole
• Type DIP, 0.3" (7.62mm) Row Spacing
• Operating Temperature -55°C ~ 105°C
• Number of Positions or Pins (Grid) 30 (2 x 15)
• Termination Solder
• Housing Material Polyamide (PA46), Nylon 4/6, Glass Filled
• Pitch - Mating 0.100" (2.54mm)
• Contact Finish - Mating Gold
• Contact Finish Thickness - Mating 10.0µin (0.25µm)
• Contact Material - Mating Beryllium Copper
• Pitch - Post 0.100" (2.54mm)
• Contact Finish - Post Tin
• Contact Finish Thickness - Post 200.0µin (5.08µm)
• Contact Material - Post Brass
• ECCN EAR99
• HTSUS 8536.69.4040
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant