技术参数

• Features Board Guide, Closed Frame
• Mounting Type Surface Mount
• Type SOIC
• Number of Positions or Pins (Grid) 8 (2 x 4)
• Termination Solder
• Material Flammability Rating UL94 V-0
• Housing Material Liquid Crystal Polymer (LCP)
• Pitch - Mating 0.050" (1.27mm)
• Contact Finish - Mating Gold
• Contact Finish Thickness - Mating 15.0µin (0.38µm)
• Contact Material - Mating Phosphor Bronze
• Pitch - Post 0.050" (1.27mm)
• Contact Finish - Post Gold
• Contact Finish Thickness - Post Flash
• Contact Material - Post Phosphor Bronze
• Contact Resistance 30mOhm
• ECCN EAR99
• HTSUS 8536.90.1100
• RoHS Status ROHS3 Compliant