技术参数

• Package / Case 153-TFBGA
• Mounting Type Surface Mount
• Memory Size 64Gbit
• Memory Type Non-Volatile
• Operating Temperature -40°C ~ 85°C (TA)
• Technology FLASH - NAND
• Memory Format FLASH
• Supplier Device Package 153-TFBGA (11.5x13)
• Memory Interface MMC
• Memory Organization 8G x 8
• DigiKey Programmable Not Verified
• ECCN 3A991B1A
• HTSUS 8542.32.0071
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status ROHS3 Compliant