Technical Details

• Package / Case 176-LFBGA
• Mounting Type Surface Mount
• Speed 33MHz
• RAM Size 8K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type ROMless
• Core Processor ARM7®
• Data Converters A/D 8x10b; D/A 2x10b
• Core Size 16/32-Bit
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
• Connectivity EBI/EMI, SPI, UART/USART
• Peripherals POR, WDT
• Supplier Device Package 176-BGA (13x13)
• Number of I/O 58
• DigiKey Programmable Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant