0436500515 5‑pin 3.00mm Header — Complete Datasheet & Pinout

The 3.00mm, 5‑pin through‑hole header is a common choice where mixed power and signal connections meet PCB robustness requirements. This article presents a concise datasheet, clear pinout, and layout best practices for designers.

This guide promises an actionable reference: a compact spec table, explicit pin numbering rules, three example pin mappings, PCB footprint recommendations, soldering and reinforcement tips, substitution checklist, procurement notes, and troubleshooting steps to speed integration into production.

Quick Specs & Electrical Ratings

0436500515 5‑pin 3.00mm Header Layout

Key Electrical Specifications

Below is a compact copy/paste spec table suitable for BOMs and quick reference. Values represent typical, conservative ranges for a 5‑pin 3.00mm through‑hole header.

Parameter Typical / Recommendation Visual Rating
Pitch 3.00 mm (0.118")
Current Rating Typical 2 A per contact (1–3 A range)
Rated Voltage Up to 250 V
Insulation Resistance > 1x10^9 Ω typical High Reliability
Operating Temp −40 °C to +105 °C Industrial Grade

Pinout Diagram & Signal Mapping

Pin numbering typically starts at the leftmost pin when viewing the header from the component side with the shroud or notch to the top. Always verify with the mechanical drawing and silk reference on the PCB silk layer.

Example A: Serial + Power

  • Pin 1: VCC
  • Pin 2: GND
  • Pin 3: TX
  • Pin 4: RX
  • Pin 5: NC

Example B: I²C + Power

  • Pin 1: VCC
  • Pin 2: GND
  • Pin 3: SDA
  • Pin 4: SCL
  • Pin 5: NC

Example C: 5‑Wire Sensor

  • Pin 1: VCC
  • Pin 2: GND
  • Pin 3: DATA
  • Pin 4: CLK
  • Pin 5: ALERT

Mechanical Dimensions & Footprint

Recommended PCB Land Pattern

  • Drill Size: Ø1.0–1.2 mm (Plated Through-Hole)
  • Pad Diameter: 1.6–2.0 mm
  • Annular Ring: ≥0.5 mm
  • Pitch Tolerance: ±0.10 mm

Pro Designer Tip: Account for header shroud height and peg positions in the mechanical drawing before finalizing 3D CAD. Create or import a 3D STEP model to check mating clearances and nearby component interference.

Mounting, Soldering & Assembly

Soldering Profile

Through‑hole options include wave, selective soldering, or manual hand soldering. Avoid excessive preheat and maintain peak solder temperatures per paste specifications.

Mechanical Support

For frequent mate/unmate cycles, add mechanical reinforcement: nearby mounting holes, glue fillets, or extra vias tied to ground plane for rigidity.

Compatibility & Alternatives

Drop-in Replacement Checklist:
  • Confirm 3.00 mm Pitch
  • Verify Pin Count (5)
  • Check Plating (Gold/Tin)
  • Alignment Peg Presence
Configuration Tradeoffs:
  • Move to 2.54mm for density
  • Dual-row for higher pin counts
  • Check signal integrity impact

Summary

  • The 0436500515 spec table gives conservative electrical ratings and footprint guidance for rapid BOM entry.
  • Follow the pin1 orientation rule and use power at ends and sensitive signals centrally for best performance.
  • Use recommended drill/pad sizes and validate with a 3D STEP model for lifecycle reliability.

Frequently Asked Questions

What is the recommended 0436500515 pinout for UART and power? +
Recommended UART + power mapping places VCC and GND at pins 1 and 2 (ends) and TX/RX in the middle (pins 3 and 4), leaving pin 5 as NC or signal ground. This minimizes noise on data lines and simplifies cable routing.
How should I reference the 5‑pin 3.00mm header footprint in my CAD library? +
Include drill size, pad diameter, annular ring, silkscreen pin‑1 marker, and courtyard layers. Store a STEP model for collision checks and a recommended land pattern for CAM. Add fabrication notes for plated through‑hole requirements.
What quick checks validate a mounted 0436500515 during first article inspection? +
Inspect for proper pin alignment, full solder fillets, no solder bridges, correct pin‑1 orientation, and mechanical stability. Perform continuity tests for each pin and a power‑up smoke test at limited current.
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